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FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
July 2008
FOD410, FOD4108, FOD4116, FOD4118 6-Pin DIP Zero-Cross Triac Drivers
Features
300mA on-state current Zero-voltage crossing High blocking voltage
Description
The FOD410, FOD4108, FOD4116 and FOD4118 devices consist of an infrared emitting diode coupled to a hybrid triac formed with two inverse parallel SCRs which form the triac function capable of driving discrete triacs. The FOD4116 and FOD4118 utilize a high efficiency infrared emitting diode which offers an improved trigger sensitivity. These devices are housed in a standard 6-pin dual in-line (DIP) package.

- 800V (FOD4108, FOD4118) - 600V (FOD410, FOD4116) High trigger sensitivity - 1.3mA (FOD4116, FOD4118) - 2mA (FOD410, FOD4108) High static dv/dt (10,000V/s) UL, VDE, CSA approved Lead free assembly
Applications
Solid-state relays Industrial controls Lighting controls Static power switches AC motor starters
Package
Schematic
6 1
6
ANODE 1
6 MAIN TERM.
1
CATHODE 2
6 1
5 NC*
N/C 3
ZERO CROSSING CIRCUIT *DO NOT CONNECT (TRIAC SUBSTRATE)
4 MAIN TERM.
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
www.fairchildsemi.com
FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
Absolute Maximum Ratings (TA = 25C unless otherwise noted)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol
TOTAL DEVICE TSTG TOPR TSOL TJ VISO PD EMITTER IF VR PD
Parameters
Storage Temperature Operating Temperature Lead Solder Temperature (Wave) Junction Temperature Range Isolation Test Voltage(1) (rms AC voltage, 60Hz, 1 min. duration) Total Device Power Dissipation @ 25C Derate above 25C
Device
All All All All All All
Value
-55 to +150 -55 to +100 260 for 10 sec 125 5000 500 8.3
Units
C C C C Vac(rms) mW mW/C mA V mW mW/C V A mA mW mW/C
Continuous Forward Current Reverse Voltage Total Power Dissipation 25C Ambient Derate above 25C
All All All
30 6 50 5.4
DETECTOR VDRM ITSM ITM PD Off-State Output Terminal Voltage Peak Non-Repetitive Surge Current (single cycle 60Hz sine wave) Peak On-State Current Total Power Dissipation @ 25C Ambient Derate above 25C FOD410, FOD4116 FOD4108, FOD4118 All All All 600 800 3 300 450 6.25
Note: 1. Isolation voltage, VISO, is an internal device dielectric breakdown rating. For this test, Pins 1, 2 and 3 are common, and Pins 4, 5 and 6 are common.
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
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FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
Electrical Characteristics (TA = 25C Unless otherwise specified)
Individual Component Characteristics
Symbol
EMITTER VF IR Input Forward Voltage Reverse Leakage Current Peak Blocking Current, Either Direction IF = 20mA VR = 6V All All 1.25 0.0001 1.5 10 V A
Parameters
Test Conditions
Device
Min.
Typ.*
Max
Units
DETECTOR ID(RMS) IF = 0, TA = 100C(2) VD = 800V VD = 600V IR(RMS) Reverse Current TA = 100C VD = 800V VD = 600V dv/dt Critical Rate of Rise of Off-State Voltage IF = 0(4) (Fig. 11) FOD4108, FOD4118 FOD410, FOD4116 FOD4108, FOD4118 FOD410, FOD4116 10,000 V/s 3 100 A 3 100 A
Transfer Characteristics
Symbol DC Characteristics
IFT LED Trigger Current
Test Conditions
Main Terminal Voltage = 5V
(3)
Device
FOD410, FOD4108 FOD4116, FOD4118
Min.
Typ.* Max. Units
0.65 0.65 2.2 200 5 60 2.0 1.3 3 500 V A mA s mA
VTM IH IL tON
Peak On-State Voltage, ITM = 300 mA peak, IF = rated IFT Either Direction Holding Current, Either Direction Latching Current Turn-On Time VT = 3V VT = 2.2V PF = 1.0, IT = 300mA VRM = VDM = 565 VAC VRM = VDM = 424 VAC
All All All FOD4108 FOD410, FOD4116, FOD4118 FOD4108 FOD410, FOD4116, FOD4118 All 10,000 5,000 All
tOFF
Turn-Off Time
VRM = VDM = 565 VAC VRM = VDM = 424 VAC
52
s
dv/dtcrq
Critical Rate of Rise of Voltage at Current Commutation Critical Rate of Rise of On-State Current
VD = 0.67 VDRM, Tj = 25C di/dtcrq 15 A/ms T = 80C j
V/s
di/dtcr
8
A/s V/s
dV(IO)/dt Critical Rate of Rise of Coupled Input/Output Voltage
IT = 0A, VRM = VDM = 424VAC
All
10,000
*Typical values at TA = 25C
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
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FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
Electrical Characteristics (TA = 25C Unless otherwise specified) (Continued)
Zero Crossing Characteristics Symbol
VINH IDRM2
DC Characteristics
Inhibit Voltage (MT1-MT2 voltage above which device will not trigger) Leakage in Inhibited State
Test Conditions
IF = Rated IFT IF = Rated IFT, Rated VDRM, off state
Min.
Typ.*
8 20
Max.
25 200
Units
V A
Isolation Characteristics
Symbol
VISO
Characteristics
Input-Output Isolation Voltage
Test Conditions
f = 60Hz, t = 1 min.
(5)
Min.
5000
Typ.*
Max.
Units
Vac(rms)
*Typical values at TA = 25C Notes: 2. Test voltage must be applied within dv/dt rating. 3. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (2mA for FOD410 and FOD4108 and 1.3mA for FOD4116 and FOD4118 and the absolute max IF (60mA). 4. This is static dv/dt. See Figure 11 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only. 5. Isolation voltage, VISO, is an internal device dielectric breakdown rating. For this test, Pins 1, 2 and 3 are common, and Pins 4, 5 and 6 are common.
Typical Application
Typical circuit for use when hot line switching is required. In this circuit the "hot" side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line. Rin is calculated so that IF is equal to the rated IFT of the part, 2mA for FOD410 and FOD4108, 1.3mA for FOD4116 and FOD4118. The 39 resistor and 0.01F capacitor are for snubbing of the triac and may or may not be necessary depending upon the particular triac and load use.
Rin VCC
1 2 FOD410 FOD4108 FOD4116 FOD4118
6 5
360 HOT FKPF12N80 39*
3
4 330 0.01F
240 VAC
LOAD * For highly inductive loads (power factor < 0.5), change this value to 360 ohms.
NEUTRAL
Figure 1. Hot-Line Switching Application Circuit
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
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FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
Typical Performance Curves
Figure 2. Forward Voltage (VF) vs. Forward Current (IF)
IFT - NORMALIZED LED TRIGGER CURRENT 1.8 1.6
Figure 3. Normalized LED Trigger Current (IFT) vs. Ambient Temperature (TA)
VAK = 5.0V Normalized to TA = 25C
VF - FORWARD VOLTAGE (V)
1.6
1.4
1.4 -55C 1.2 25C 1.0 85C
1.2
1.0
0.8
0.8
0.6 0.1
1 10 IF - FORWARD CURRENT (mA)
100
0.6 -60
-40
-20 0 20 40 60 TA - AMBIENT TEMPERATURE (C)
80
100
Figure 4. Peak LED Current vs. Duty Factor, Tau
10000 If(pk) - PEAK LED CURRENT (mA)
Duty Factor
Figure 5. Trigger Delay Time
100 tD = t(IF/IFT 25C) VD = 400VP-P F = 60Hz tD - DELAY TIME (s)
1000
0.005 0.01 0.02 0.05 0.1 0.2
DF =
t t
10
100
0.5
10 10-6
10-5
10-4 10-3 10-2 10-1 t - LED PULSE DURATION (s)
100
101
1
1
10 IFT/IF - NORMALIZED IF (mA)
100
Figure 6. Pulse Trigger Current
1.7 IFTH(PW)/IFTH(DC) - NORMALIZED IFTH ITM - ON-STATE CURRENT (mA) 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9
VL = 250VP-P F = 60Hz Normalized to DC
Figure 7. On-State Voltage (VTM) vs. On-State Current (ITM)
1000
100
TA = 100C
10
TA = 25C
0
200
400 600 PW - PULSE WIDTH (s)
800
1000
1
0
1
2
3
4
5
6
VTM - ON-STATE VOLTAGE (V)
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
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FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
Typical Performance Curves (Continued)
Figure 8. Normalized Holding Current (IH) vs. Ambient Temperature (TA)
Normalized to TA = 25C
Figure 9. Off-State Current (IBD) vs. Ambient Temperature (TA)
1000 IBD - OFF-STATE CURRENT (mA)
VD = VDRM f = 60Hz
2.2 IH - NORMALIZED HOLDING CURRENT 2.0 1.8 1.6 1.4 1.2 1.0 0.8 -60
100
10
1
0.1 -40 -20 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (C)
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE (C)
1.2 VINH (NORM) = VINH (TA) / VINH (25C)
Figure 10. Normalized Inhibit Voltage (VINH) vs. Ambient Temperature (TA)
IF = Rated IFT Normalized to TA = 25C
2.5 IDRM (NORM) = IDRM2 (TA) / IDRM2 (25C)
Figure 11. Normalized Leakage in Inhibit State (IDRM) vs. Ambient Temperature (TA)
IF = Rated IFT VDRM = 600V Normalized to TA = 25C
2.0
1.1
1.5
1.0
1.0
0.9
0.5
0.8 -60
-40
-20
0
20
40
60
80
100
0.0 -60
-40
-20
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE (C)
TA - AMBIENT TEMPERATURE (C)
Figure 12. Current Reduction
350 ITP - PEAK ON-STATE CURRENT (mA)
ITP = f(TA)
300
250
200
150
100
50 -60
-40
-20
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE (C)
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
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FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
5V VCC 300
1 2 MOC3011 FOD4116
FOD4118 FOD410 FOD4108
6
180 R1 C1
ZL R2
7400
4
115 Vac
NOTE: Circuit supplies 25mA drive to gate of triac at Vin = 25V and TA < 70C TRIAC IGT 15 mA 30 mA 50 mA R2 2400 1200 800 C 0.1 0.2 0.3
27 VDRM/VRRM SELECT X100 PROBE 1 2 X100 PROBE 6 DUT 4 470pF MOUNT DUT ON TEMPERATURE CONTROLLED Cu PLATE dV dt VERNIER 0.001 0.005 1 MEG 82 2W 0.01 2W POWER 0.047 1N914 20V 56 2W 1000 1/4W RFP4N100 0.47 1N967A 18V 0-1000V 10mA 0.1 TEST 2W EACH 1.2 MEG 20k 2W 0.33 2W 1000 10 WATT WIREWOUND 1000V
DIFFERENTIAL PREAMP
0.047 1000V
100 2W
f = 10 Hz PW = 100 s 50 PULSE GENERATOR
ALL COMPONENTS ARE NON-INDUCTIVE UNLESS SHOWN
Figure 11. Circuit for Static
dV Measurement of Power Thyristors dt
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
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FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
240 VAC R1 VCC Rin 1 2
FOD410 FOD420 FOD4108 FOD4208 FOD4116 FOD4216 FOD4118 FOD4218
D1
6 5 360 SCR SCR 4
3
R2
D2 LOAD
Figure 12. Inverse-Parallel SCR Driver Circuit
Suggested method of firing two, back-to-back SCR's with a Fairchild triac driver. Diodes can be 1N4001; resistors, R1 and R2, are optional 330. Note: This optoisolator should not be used to drive a load directly. It is intended to be a discrete triac driver device only.
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
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FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
Package Dimensions
Through Hole
0.307 (7.8) 0.267 (6.8)
Surface Mount
0.307 (7.8) 0.267 (6.8)
0.275 (7.0) 0.236 (6.0)
0.275 (7.0) 0.236 (6.0)
0.412 (10.46) 0.388 (9.86)
0.312 (7.92) 0.288 (7.32)
0.051 (1.3) 0.043 (1.1)
0.312 (7.92) 0.288 (7.32)
0.157 (4.0) 0.118 (3.0)
0.157 (4.0) 0.118 (3.0)
0.020 (0.50) 0.010 (0.25)
0.020 (0.5) 0.024 (0.6) 0.016 (0.4)
0.024 (0.6) 0.016 (0.4) 0.100 (2.54)
0.100 [2.54]
0.049 (1.25) 0.295 (0.75)
0.4" Lead Spacing
0.307 (7.8) 0.267 (6.8)
Recommended Pad Layout for Surface Mount Leadforms
0.060 (1.5)
0.275 (7.0) 0.236 (6.0)
0.51 (1.3)
0.100 (2.54) 0.354 (9.0)
0.157 (4.0) 0.118 (3.0)
0.030 (0.76)
0.130 (3.3) 0.090 (2.3) 0.100 [2.54] 0.020 (0.50) 0.010 (0.25 ) 0.420 (10.66) 0.380 (9.66)
0.024 (0.6) 0.016 (0.4)
Note: All dimensions are in inches (millimeters)
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
www.fairchildsemi.com 9
FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
Ordering Information
Option
None S SD T V TV SV SDV
Order Entry Identifier (example)
FOD410 FOD410S FOD410SD FOD410T FOD410V FOD410TV FOD410SV FOD410SDV Surface Mount Lead Bend
Description
Standard Through Hole Device Surface Mount; Tape and reel 0.4" Lead Spacing IEC60747-5-2 certification IEC60747-5-2 certification, 0.4" Lead Spacing IEC60747-5-2 certification, Surface Mount IEC60747-5-2 certification, Surface Mount, Tape & Reel
Marking Information
1
FOD410 V
3 4
2 6
X YY D
5
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark indicates IEC60747-5-2 certified (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code, e.g., `7' Two digit work week ranging from `01' to `53' Assembly package code
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
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FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
Carrier Tape Specifications
12.0 0.1 2.0 0.1 4.2 0.2 0.30 0.05 4.0 0.1 O1.55 0.05 1.75 0.10
7.5 0.1 16.3 15.7 7.7 0.1 0.1 MAX User Direction of Feed 10.4 0.1
Note: All dimensions are in inches (millimeters).
Reflow Profile
300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute) * Peak reflow temperature: 260 C (package surface temperature) * Time of temperature higher than 183 C for 160 seconds or less * One time soldering reflow is recommended Time above 183C, <160 sec Ramp up = 2-10C/sec 260 C peak 245 C, 10-30 s
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
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FOD410, FOD4108, FOD4116, FOD4118 -- 6-Pin DIP Zero-Cross Triac Drivers
TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. ACEx(R) Build it NowTM CorePLUSTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) EZSWITCHTM * TM
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* EZSWITCHTM and FlashWriter(R) are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only.
Rev. I33
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
(c)2004 Fairchild Semiconductor Corporation FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.1.4
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